LithoTalk

[Guest1]

I carry out some dry etching process on silicon to obtain 1.5 micron deep features. The process is very satisfactory in many aspects but has one problem. The roughness is very huge (about 100nm) and i tried several alternatives but couldnt minimize the roughness. Is there any way to reduce the roughness by wet etching methods after my dry etching process? If not, can anyone suggest a good dry etching recipe to etch 1 micron and smaller features to 1.5 micron depth?

Thanks....